HDI PCB---High density interconnects
Printed Circuited Boards
What is an HDI PCB?
4 Layer HDI PCB with 0.38mm pitch BGA4 Layer HDI PCB with 0.38mm pitch BGA
Min trace/space: 0.076/0.0/76mm
Via in pad, POFV (Plated over filled vias)
4 layer 1.0mm Laser drilling¥ 0.00
Quick Turn HDI PCB--shipping in 5 daysTwo designs,4 layer HDI PCB,0.4mm pitch BGA¥ 0.00
4 layer HDI with 0.4mm,shipping in 5 days.4 layer HDI
Via in pad
Half hole plating
Quick Turn shipping in 5 days.¥ 0.00
ENEPIG for RO4350B with blind vias from L1-L2,L3-L4ENEPIG for RO4350B with blind vias from L1-L2,L3-L4¥ 0.00
4.4mm PCB with blind vias and countersink holes4.4mm PCB ,4 Layer
Blind vias L1-L2 ,L3-L4
Matt Black solder mask
Via in pad
12:1 (Thickness :min hole)¥ 0.00
Soft Gold plating with 30 Micro inch PCBFR4 :4 layer 1.6mm 1oz
Full gold at top and bottom side in units
Soft Gold with 30 micro inch
Black solder mask,white silkscreen¥ 0.00
0.4mm pitch BGA PCB with 0.1/0.1mm0.4mm pitch BGA
BGA pad 0.2mm
4 layer 1.6mm
min trace/space 0.1/0.1mm¥ 0.00
10 layer RF PCB with RO4350B+FR410 layer RF PCB with RO4350B+FR4
Blind vias L1-L2,L9-L10
Via in pad ,POFV
RO4350B 6.6mil¥ 0.00
L1-L2,L1-L3,L1-L6 8 layer HDI PCBL1-L2,L1-L3,L1-L6
8 layer HDI PCB
PCB material:TU-768, TG170
Via in pad¥ 0.00
10 Layer rigid-flex PCB made by Storm Circuit10 Layer rigid-flex PCB made by Storm Circuit
PCB layers:10 layers
Immersion Gold¥ 0.00
Our HDI PCB products
HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products such as touch screen computing and 4G network communications,now it is 5G time,any layer technology is required for PCB .
HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products. Most HDI boards are with burried/blind vias from 0.076-0..127mm.
Vias for HDI is 3-5 mil (0.076-0.127mm),line width is from 3-4mil(0.076-0.1mm). 0.8mm /0.5mm pitch BGA is usually for 1+N+1. Another thing is many customers did not know HDI board have to use special material--RCC (Resion Coated Copper),0.08mm thickness with copper.
0.4mm pitch BGA, means the space from BGA ball to another BGA ball is 0.4mm.
Many PCB designers do not know much how to design 0.4mm pitch BGA board,they make things very difficult to do .Here is a 0.4mm pitch BGA PCB design guide from TI OMAP processor. Pages 8 through 12 talk about pads, mask and vias. Obviously, you should consult similar materials written specifically for the part you are using, but Ti did a great job of covering all the issues here
Gerber file for 6 layer HDI board.
Specification:FR4,TG170,1.2mm,1oz for all layers.
min via:0.15mm, min trace/space:0.1/0.1mm.
Black solder mask,ENIG
Blind/burried vias (L1-L2,L1-L3,L4-L6,L5-L6）
Storm Circuit Technology Ltd, Made in China with Love.